| Microelectronic devices for most commercial | | | | organic synthesis which comes from raw material |
| applications are encased in a plastic packaging | | | | of resin. Resin is used in cosmetic product like nail |
| material such as Potting compound, a glob top or | | | | polish. In the compound though synthetic resin is |
| a molding compound. It is liquid that consist of two | | | | used which has the properties of the natural resin. |
| parts: a resin and a hardener or accelerator. They | | | | It is a viscous liquid which has the capability of |
| are mixed in a defined ratio to uniformity and | | | | hardening. The synthetic resin is manufactured |
| then de-aired under reduced pressure prior to | | | | typically by chemical reaction called "estreification" |
| application. | | | | or soaping of organic compounds. |
| Potting compound is also referred to as | | | | The Epoxy resin is two times harder than |
| encapsulants. There is several type like Epoxy, | | | | cement, it's seamless and waterproof. Epoxy |
| silicone, polyurethane and thermal potting | | | | based potting compound is recommended for any |
| compound. The other include Acrylic potting | | | | chemical exposure. The modern electronic devices |
| compounds are UV and heat hardening materials, | | | | are smaller in size and are powerful, these device |
| Polyester and hot melt potting compounds. | | | | therefore require running at higher temperature. |
| The important features: | | | | To improve the longevity and reliability of the |
| 1. Low viscosity and long pot life at application | | | | electronic device it has to spread out the heat |
| temperature. | | | | efficiently. In these devices the alternate molds |
| 2. Appropriate cure speed at a reasonable cure | | | | made of plastic which are not very effective in |
| temperature | | | | transferring heat are used to reduce the weight |
| 3. Good adhesion to and compatibility with all | | | | of the device and the cost. |
| surfaces of substrates. | | | | Therefore the thermally conductive compounds |
| 4. Requires low stress particularly when it's a | | | | which are very effective in controlling heat built up |
| ceramic base or substrates board is used. | | | | in electric assembly are used. The heating areas in |
| 5. Its resistance to filler settling | | | | the device or sinks are bond with Epoxies, |
| 6. Good thermal stability | | | | urethanes and silicones to encapsulate power |
| 7. Good electrical insulating properties. | | | | supplies and individual components and protect |
| The coniferous tree and many other plants | | | | motors from overheating. The heat from the |
| secrete hydrocarbon which is called resin. | | | | heat generating enclosure is made to uniformly |
| Varnishes and adhesive chemical constituents | | | | travel away or to air through a pathway made |
| come from resin. Incense and perfume consist of | | | | from the thermally conductive potting compounds. |